High-Temperature / Low-Temperature Joining
Suitable for component defect repair and dissimilar material joining, categorized based on thermal resistance requirements.
Low-Temperature Bonding
Epoxy Resin
Operating Temperature
250 ℃
Instantaneous Temperature
300 ℃
Low-Temperature Bonding
High-Temperature Resistant Inorganic Adhesive
Operating Temperature
300 ℃
Instantaneous Temperature
380 ℃
High-Temperature Resistant Ceramic Adhesive
Operating Temperature
800 ℃
Instantaneous Temperature
1000 ℃
